Advanced Photonics Inc. , a company specialized in semiconductors, optical communications and optical interconnection

  • Api was established on the ba sis of the long years of research on semiconductors, optical communications and optical interconnection conducted by a group headed by Mr.Yoshiaki Nakano in his research lab. at the University of Tokyo Research Center for Advanced Science and Technology.
  • Api has its sights firmly fixed on the activities in the global market and creates highly competitive products which may be regarded as global standard.
  • Api infinitely pursues potential of photonics and creates new value, thereby contributing to development of society and mankind.
  • Api manages its organization in a manner where incentives for its employees are harmonized with the company’s growth and profitability, and returns satisfactory profits to its shareholders.
    • api_news more information

    2012/6/13～15
    Large Electronics Show 2012Exhibitor at the ‘Large Electronics Show 2012’
    APi will be exhibiting our new products and technologies at the “Large Electronics Show 2012” in Tokyo, in the Big Site convention facilities. This is to be held in June, over three days (13th to the 15th). Please come and visit us at our booth (50-1), situated near the entrance ‘East Hall 6’.

    http://www.jpcashow.com/show2012/English/

    2012/6/6～7
    Please come and visit our exhibition at the “ADVANTEST EXPO 2012”.
    ADVANTEST EXPO 2012This will be held in the Tokyo International Forum, on the 6th and 7th of June 2012. We will be exhibiting our new products and technologies at our booth, in the ‘Near Future/Future Zone’.

    http://www.advantestexpo2012.jp/en-index.html

    2012/5/1　
    Sony has recently announced a professional use movie camera, ‘CineAlta F65’, having the industries highest image resolution of 4K2K. This camera employs optical interconnect technology jointly developed with APi.
    (Details are attached to the top column of the Media coverage)
    http://www.sony.co.jp/SonyInfo/News/Press/201202/12-029/

    2012/4/11～13
    Photonix 2012APi will be taking part in “Photonix 2012”, which is to be held from the 11th to 13th of April 2012, at the Big Site Tokyo. We will be exhibiting our products and showcasing our new technologies at our booth (28-10) situated in the right side of East Hall 4. Please feel free to come and visit us.
    http://www.photonix-expo.jp/en/Home/

    2012/2/23
    We gave an invited presentation on the MOT (Management of Technology) Special Educational Program, which was held at the Graduate School of Science and Technology in Kumamoto University, on the 23th of February. The talk was part of the venture study group business and was entitled, “How to target new markets created by technology～the challenges facing university based venture business companies”.
    http://www.gsst.kumamoto-u.ac.jp/detail.php?type=news&tday=20120213&ttime=090729

    2012/2/22
    JPCA show 2011APi is pleased to announce a new product, an Active Optical Cable for use in InfiniBand interconnections, which has passed IBTA (InfiniBand Trade Association) authorization. These cables allow for bi-directional serial links between processors and/or peripherals for high-speed data flow.
    ・Type DDR：20Gbps １～100ｍ
    ・Type QDR：40Gbps １～100ｍ
    Interested parties please click here for further details (PDF File).

    ＜Reference＞ We are listed as one of the IBTA Integrators on the homepage of the Authorization company（IBTA Integrators List）.
    http://www.infinibandta.org/content/pages.php?pg=integrators_list_overview


    api_media more information

    2012/5/1
    The world's first mass production of a lensless optical interconnection module has been successfully undertaken, due to newly developed semiconductor technology.
    For details, please refer to here(PDF file)

    2012/3/29
    APi was showcased on the website of Tokyo Bureau of Industrial and Labor Affairs under the heading of "Bright technology: Optical Business."
    kirari-tech.metro.tokyo.jp

    Electronic Packaging Technology2009/10
    In the October 2009 Japanese journal Electronic Packaging Technology release we released an article entitled “The development of light interconnect PCB substrate technology to facilitate a light testing system”
    The translation of this publication is given here (pdf file)